IPFA 2021 – 28th International Symposium on the Physical and Failure Analysis of Integrated Circuits
14 September – 13 October (GMT +8)

Why you should register?

Speakers

Keynote

Muhammad Mustafa Hussain

UC Berkeley, USA

Anomalous Mechanical Deformation – New Variable in Reliability for Flexible and Stretchable CMOS Electronics

Noah Lassar

Waymo, USA

Reliability Insights from 25 Million Fully Autonomous Miles

Professor Aaron Thean

National University of Singapore, Singapore

What’s wrong with my chip? – Dr. AI, can you please diagnose?


Tutorial

Dr. Franco Stellari

IBM, USA

Faster fault isolation with advanced data analysis and computer vision

Dr. Jong-Shing Bow

iST Group, Taiwan

Introduction of TEM/STEM Techniques and Some Puzzles of Them in Analyzing Nano Materials

Dr. Umberto Celano

Retain IMEC, Belgium

University of Twente, Netherlands

Scanning Probe Microscopies for Correlative Analysis of Advanced Technology Nodes

Professor Massimo Vanzi

University of Cagliari, Italy

Laser Diodes: an introductory Tutorial

Professor Christian Boit

Technische Universität Berlin, Germany

Contactless Fault Isolation Techniques and IC Hardware Security

Professor Tan Chuan Seng

Nanyang Technological University, Singapore

3D IC Process Technology – Drivers, Technology Platforms, Challenges & Solutions

Professor Tuo-Hung Hou

National Chiao Tung University, Taiwan

Robust and Reliable Design for In-Memory Computing

Dr. Oliver Aubel

Global Foundries, Germany

Automotive Reliability Requirements & Challenges for Semiconductor Foundries


Invited

Professor Xing Wu

East China Normal University, China

ESD failure analysis by using transmission electron microscopy at the atomic scale

Dr. Alok Ranjan

Singapore University of Technology and Design, Singapore

Dielectric Breakdown in Hexagonal Boron Nitride

Professor Weidong Zhang

Liverpool John Moore University, United Kingdom

Reliability and Characterization of GeSe OTS Selector Device

Dr. I-Ting Wang

National Yang Ming Chiao Tung University, Taiwan

Evaluation of Breakdown Interference and Strategy of Mitigating Yield Loss in Crossbar Memory Arrays

Dr Steven H Voldman

Dr. Steven H Voldman LLC, USA

Latchup: From the beginning to today

Dr Yuan Yuan Shi

IMEC, Belgium

Wafer-scale epitaxial 2D transition metal dichalcogenides for high-performance scaled transistors

Dr Markus Herklotz

Global Foundries, Germany

BEOL Reliability Challenges using advanced nodes for automotive applications

Mr. Jayant D'Souza

Siemens Digital Industries Software, USA

Localization of Front-End Defects using Volume Scan Diagnosis

Dr. Francesco Puglisi

Università degli Studi di Modena e Reggio Emilia, Italy

Random Telegraph Noise for Advanced True Random Number Generation in the IoE ecosystem

Professor Christian Boit

Technische Universität Berlin, Germany

Logic state imaging - From FA techniques for special applications to one of the most powerful hardware security side-channel threats

Dr. Franco Stellari

IBM, USA

Tool automation and computer vision methodologies for faster IC diagnostics

Professor Tan Chuan Seng

Nanyang Technological University, Singapore

3D MIM Capacitor Embedded in TSV: Concept, Device Demonstration, Reliability and Applications

Professor Massimo Vanzi

University of Cagliari, Italy

Wave aspects in Laser Diode Catastrophic Optical Damage

Sponsors

Frequently Asked Questions

Yes, there are two categories of registrations, namely: (1) Exhibition Free Pass and (2) Full Symposium Ticket. Click on the Register button and choose your preferred type of access in the registration form. Follow on-screen instructions to complete payment process for full conference access.
Category 1 (Exhibition Free Pass) users can receive access to the Exhibition Hall while category 2 (Full Symposium Ticket) users can receive access to all content of the virtual conference (Auditorium, Exhibition Hall, Swag Bag, Lucky Draw and many more).
No. You do not need to download or install any software to participate. You only need to have access to the internet, so you can participate wherever you are. We also recommend attendees to access the platform via a personal computer to have the best online experience.
You can use your email address and password that you have entered during registration to login on the day of IPFA 2021.
IPFA 2021 will remain open 24/7 from 14 September to 13 October! Recordings of live events will be made available on the platform. Therefore, you can attend whenever it is convenient for you during this period of time.
Yes. Like a physical event, we will have a swag bag for you! You can add all of the documents available to the online swag bag in your account and then email them to yourself or share items with your colleagues simply by entering their email.
This is an online event. You do not have to travel to any specific location. You can participate anywhere that you have Internet access.